Some common problems in electronic waterproof protection technology are listed below for reference. Due to the influence of various factors such as the requirements of product structure and use environment in the actual application process, the problems encountered and corresponding solutions are also different. For any technical support, please contact us.
LPM can over-mold extensively products and enhance product performance.LPM technology benefits mainly reveal in two aspects below:
Product Performance
Environmentally friendly (RoHS).
Water-proof.
Electrical insulation.
Mechanical protection from impact.
Resistance to temperature (UL94 V-0).
Resistance to Chemical.
Production
Simplify the process, enhance productivity.
Shorten the development cycle, reduce the R&D cost.
Save production space.
No hazardous materials during production.
Thermoplastic no cure time and increased reliability.
Molds design flexibility.
Low pressure molding technology can be applied to wide range of industries and any unique product that needs to be sealed and protected against the environment such as PCB, automotive electronics, automotive wire, connector, sensor, micro switch etc.
More Application details： http://www.jiagugc88.cn/q_case/img.php?lang=en&class1=329
LPMS selects high performance hot-melt adhesive, which has excellent mobility. The adhesive takes very small pressure to make it flow to mold, therefore, the products successfully over-molded without causing any harm in the process, greatly reducing the defect product.
PA Hot melt LPM | Traditional molding | |
Material | PA Hot melt resin | ABS、PBT、PP |
Injection pressure | 1.5~40 bar | 350~1,300 bar |
Injection temperature | 190~230℃ | 230~300℃ |
Clamping force | 1 Ton | Over 50 Tons |
Mould material | Steel and aluminum | Only steel |
Damage to the mold | No damage | Wear and tear |
Injection machine | Air cylinder driven | Hydraulic driven |
PA Hot melt LPM | Epoxy molding | |
Case | Need | Meed case |
Working temperature | -70~150℃ | 180℃ |
Housing | No need housing | Need housing |
Cycle time | 2-60 seconds | Chemical reaction needs 24 hours |
density | 0.98 | Above 1.2 |
Curing | Much less curing time | Need curing |
Working space | Occupy less space | Occupy large space |
Energy consumption | Low | High |
Resin consumption | Less | Much more |
Process | Simple | Complex |
Vacuum pumping | No need | Need |
Low pressure molding material’s shrinkage rate is slightly lower than traditional molding material. Low pressure molding contraction ranges between 1%~1.5％. It depends on materials.
Mold structure design, such as increasing the exhaust inserts, the way of injection.
Mold DFM.
For larger injection volume products, we might design multiple injection to avoid it.
Using transparent resin to test and adjust molding parameters through mold trial and small production of the samples.
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